{"title":"Gate-Misalignment-Effect Related Capacitance Behavior of a 100nm Double-Gate FD SOI NMOS Device with n+/p+Poly Top/Bottom Gate","authors":"J. Kuo, C. Hsu, C.P. Yang","doi":"10.1109/EDSSC.2005.1635290","DOIUrl":null,"url":null,"abstract":"This paper reports the gate-misalignment-effect related capacitance behavior of a 100nm double-gate (DG) fully-depleted (FD) SOI NMOS device with the n<sup>+</sup>p<sup>+</sup>poly top/bottom gate. Based on the 2D simulation result, with the gate misalignment, the sudden fall in the gate-drain/source capacitance (C<inf>GD</inf>/C<inf>GS</inf>) of the device at V<inf>G</inf>=0.5V is mitigated due to the reduced hole accumulation/ depletion in the bottom channel controlled by the p<sup>+</sup>bottom gate with the increased fringing electric field effect.","PeriodicalId":429314,"journal":{"name":"2005 IEEE Conference on Electron Devices and Solid-State Circuits","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-12-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 IEEE Conference on Electron Devices and Solid-State Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDSSC.2005.1635290","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
This paper reports the gate-misalignment-effect related capacitance behavior of a 100nm double-gate (DG) fully-depleted (FD) SOI NMOS device with the n+p+poly top/bottom gate. Based on the 2D simulation result, with the gate misalignment, the sudden fall in the gate-drain/source capacitance (CGD/CGS) of the device at VG=0.5V is mitigated due to the reduced hole accumulation/ depletion in the bottom channel controlled by the p+bottom gate with the increased fringing electric field effect.
本文报道了带有n+p+聚顶/底栅极的100nm双栅(DG)满耗尽(FD) SOI NMOS器件的栅极失调效应相关电容行为。二维仿真结果表明,当栅极错位时,器件在VG=0.5V时的栅极-漏极/源极电容(CGD/CGS)的突然下降得到了缓解,这是由于p+底栅极控制的底沟道空穴积累/耗尽减少,边缘电场效应增强。