RFIC Complexity a Challenge for Academia and Industry

S. Heinen, F. Henkel
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Abstract

Over the last 25 years RF integrated circuits have evolved from bipolar ICs integrating a handful of transistors into highly complex RF CMOS SoCs with millions of transistors. The high volume of mobile and short-range communication terminals has been the major driving force behind the evolution. RF BiCMOS and RF CMOS have opened the stage for creativity in the implementation of RF architectures. Homodyne, Low-IF and Sliding-IF are some of the mayor milestones on the receive side. For the transmit side digital RF techniques e.g., ADPLLs and RF-DACs have matured over the last few years. The evolution of the technical capabilities described combined with market demands of high volume of mobile and short-range communication terminals are driving the complexity RF SoCs in academia and industry. The complexity of RF ICs in academia a probably an order of magnitude low than in industry, whereas the experience of experienced industrial R&D compensates this compared to student IC designers. Thus, pre-tapeout verification is a mayor challenge for both groups in order to achieve a “fully functional first-time right design” of RF SoCs.
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RFIC复杂性是学术界和工业界面临的挑战
在过去的25年里,射频集成电路已经从集成少数晶体管的双极ic发展到具有数百万晶体管的高度复杂的射频CMOS soc。大量的移动和短程通信终端一直是这一演变背后的主要推动力。RF BiCMOS和RF CMOS为RF架构的实现开辟了创造性的舞台。Homodyne、Low-IF和Sliding-IF是接收端的主要里程碑。对于发射端数字射频技术,例如adpll和RF- dac在过去几年中已经成熟。所描述的技术能力的发展与大量移动和短距离通信终端的市场需求相结合,推动了学术界和工业界RF soc的复杂性。学术界射频集成电路的复杂性可能比工业界低一个数量级,而与学生IC设计师相比,经验丰富的工业研发经验弥补了这一点。因此,为了实现RF soc的“全功能首次正确设计”,预带出验证是两个团队面临的主要挑战。
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