A X Band Ceramic Package with Kilowatt-level High-power and Low Loss

Abstract

With the increase of the power density of microwave power devices, the ceramic packages of microwave power devices are required a high frequency, low loss and high heat dissipation. A X band ceramic package with kilowatt-level high-power and low-loss is designed based on diamond/Cu composites which is a very important heat dissipation material in high-power microwave devices. In order to avoid the air breakdown of arc phenomenon and improve the current carrying capacity of ceramic insulator, the insulator of ceramic package for kilowatt-level microwave high-power device has changed the conventional side metallization structure and adopted the side special-shaped metallization structure. In addition, the RF transmission structure of the package has a low loss by optimizing with HFSS software and is manufactured by multilayer high-temperature co-fired ceramic (HTCC) process. The measured results exhibit the return loss value better than 14 dB and the insertion loss value better than 0.25 dB over a wide frequency range from DC up to 12 GHz.