{"title":"Characterization of SWCNT-based TSV","authors":"K. Salah","doi":"10.1109/EPEPEMC.2014.6980577","DOIUrl":null,"url":null,"abstract":"High performance 3D TSV interconnects are important for reliability, choice of the filler material is also a critical issue as thermal incompatibility, electromigration and, high resistivity are still a bottleneck. In this paper, SW-CNT bundles as a prospective filler material for TSV are investigated compared to conventional filler materials like Cu, W, and poly-silicon. It is found that SW-CNT bundles exhibit unique electrical, thermal, and mechanical characteristics that can be used to fabricate better TSV interconnects.","PeriodicalId":325670,"journal":{"name":"2014 16th International Power Electronics and Motion Control Conference and Exposition","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-12-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 16th International Power Electronics and Motion Control Conference and Exposition","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPEMC.2014.6980577","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
High performance 3D TSV interconnects are important for reliability, choice of the filler material is also a critical issue as thermal incompatibility, electromigration and, high resistivity are still a bottleneck. In this paper, SW-CNT bundles as a prospective filler material for TSV are investigated compared to conventional filler materials like Cu, W, and poly-silicon. It is found that SW-CNT bundles exhibit unique electrical, thermal, and mechanical characteristics that can be used to fabricate better TSV interconnects.
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