Top-down fabrication of silicon nanowire sensor using electron beam and optical mixed lithography

S. Rahman, N. Yusof, M. Hamidon, R. M. Zawawi, U. Hashim
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引用次数: 5

Abstract

The realization of reliable nanobiosensor devices requires the improvement of fabrication techniques to form the nanometer-sized structures and patterns, which were used to attach nano materials such as DNA for the device elements. This study demonstrates the sensitivity of silicon nanowires (SiNWs)as a sensing element in sensor application. Starting with silicon on insulator (SOI) material, the SiNWswith <;100nm in width were fabricated using electron beam lithography combined with conventional CMOS process. Different numbers of SiNWs which are single, 10 arrays of nanowires and 20 arrays of nanowires were developed. Subsequently, the two metal electrodes which are designated as source (S) and drain (D) were fabricated on top of individual SiNWs using optical lithography process. Optical and electrical characteristic have been proposed to verify the outcome of the fabricated structures. One major part is to observe the SiNWs optically in order to meet the nano-scale variation by using High Power Microscope (HPM) inspection and Field Emission Scanning Electron Microscope (FESEM) imaging. Finally, the samples will be tested electrically using I-V measurement system. The results show thatdevice with single SiNW with 60nm in width give the highest resistivity value due to surface to volume ratio.
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利用电子束和光学混合光刻技术自顶向下制造硅纳米线传感器
实现可靠的纳米生物传感器器件需要改进制造技术以形成纳米尺寸的结构和图案,这些结构和图案用于连接器件元件的纳米材料(如DNA)。本研究证明了硅纳米线作为传感元件在传感器应用中的灵敏度。从绝缘体上硅(SOI)材料入手,采用电子束光刻结合传统CMOS工艺制备了宽度< 100nm的sinws。分别制备了不同数量的单纳米线、10组纳米线和20组纳米线。随后,使用光刻工艺在单个sinw上制作了两个指定为源极(S)和漏极(D)的金属电极。提出了光学和电学特性来验证制造结构的结果。其中一个主要部分是通过高倍显微镜(HPM)检测和场发射扫描电镜(FESEM)成像对SiNWs进行光学观察,以满足纳米尺度的变化。最后,将使用I-V测量系统对样品进行电气测试。结果表明,宽度为60nm的单SiNW器件,由于表面体积比的关系,其电阻率值最高。
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