{"title":"Analysis of power delivery network constructed by irregular-shaped power/ground plane including densely populated via-hole","authors":"Heeseok Lee, Youngsoo Hong, D. Kam, Joungho Kim","doi":"10.1109/SPI.2004.1408994","DOIUrl":null,"url":null,"abstract":"Due to the high speed and low power trends, the design of the power distribution network (PDN) in multi-layer printed circuit board (PCB) becomes more important. This paper presents a fast and efficient analysis methodology for power/ground plane pair considering irregular shaped power plane and via effects in the frequency-domain. The proposed method uses parallel-plate transmission line theory and partitioning of the plane considering geometry properties. Using the popularly used circuit simulator SPICE, we have analyzed input-impedance of the power/ground plane pair. Due to the higher accuracy and the faster simulation time, the proposed method is applicable to the early design step of multi-layer PCB. Characteristic of power distribution network implemented by perforated plane is determined based on full-wave analysis using FDTD periodic structure modeling method.","PeriodicalId":119776,"journal":{"name":"Proceedings. 8th IEEE Workshop on Signal Propagation on Interconnects","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2004-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. 8th IEEE Workshop on Signal Propagation on Interconnects","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SPI.2004.1408994","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
Due to the high speed and low power trends, the design of the power distribution network (PDN) in multi-layer printed circuit board (PCB) becomes more important. This paper presents a fast and efficient analysis methodology for power/ground plane pair considering irregular shaped power plane and via effects in the frequency-domain. The proposed method uses parallel-plate transmission line theory and partitioning of the plane considering geometry properties. Using the popularly used circuit simulator SPICE, we have analyzed input-impedance of the power/ground plane pair. Due to the higher accuracy and the faster simulation time, the proposed method is applicable to the early design step of multi-layer PCB. Characteristic of power distribution network implemented by perforated plane is determined based on full-wave analysis using FDTD periodic structure modeling method.
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