{"title":"Integrated circuit technology options for RFIC's-present status and future directions","authors":"L. Larson","doi":"10.1109/CICC.1997.606607","DOIUrl":null,"url":null,"abstract":"This paper summarizes the technology tradeoffs that are involved in the implementation of radiofrequency integrated circuits for wireless communications. Radio transceiver circuits have a very broad range of requirements-including noise-figure, linearity, gain, power dissipation. The advantages and disadvantages of each of the competing technologies-Si CMOS, and BJT, Si/SiGe HBTs, and GaAs MESFETs, PHEMTs and HBTs are examined.","PeriodicalId":111737,"journal":{"name":"Proceedings of CICC 97 - Custom Integrated Circuits Conference","volume":"4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-05-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"265","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of CICC 97 - Custom Integrated Circuits Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CICC.1997.606607","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 265
Abstract
This paper summarizes the technology tradeoffs that are involved in the implementation of radiofrequency integrated circuits for wireless communications. Radio transceiver circuits have a very broad range of requirements-including noise-figure, linearity, gain, power dissipation. The advantages and disadvantages of each of the competing technologies-Si CMOS, and BJT, Si/SiGe HBTs, and GaAs MESFETs, PHEMTs and HBTs are examined.
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