PC Board Characterization Using Accurate Hybrid Probing Techniques

S. Gross, L. Dunleavy, T. Weller, B. Schmitz, T. Winslow
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引用次数: 4

Abstract

A systematic measurement and modeling strategy is described for complete characterization of a printed circuit board comprising a power amplifier circuit. Hybrid wafer probing is used in conjunction with TRL ¿on-board¿ calibration to derive precise characterization data for grounded coplanar waveguide lines as well as lumped surface mount components. Excellent agreement is shown between measurement based lumped component models, and transmission line structures as well as composite matching networks.
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使用精确的混合探测技术表征PC板
描述了一种用于完整表征包含功率放大器电路的印刷电路板的系统测量和建模策略。混合晶圆探测与TRL“机载”校准一起使用,以获得接地共面波导线以及集总表面贴装组件的精确特性数据。基于测量的集总组件模型与传输线结构和复合匹配网络之间具有良好的一致性。
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The effect of load variations on on-wafer lumped element based calibrations Substrate-Dependent Air-Wound Inductor Model in the DC-4 GHz Range PC Board Characterization Using Accurate Hybrid Probing Techniques Sources of Error in Coplanar-Waveguide TRL Calibrations Measurement and Analysis of the Channel Characteristics of an In-Building Wireless Network
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