Up-state and Down-state Capacitance Measurement in RF MEMS One-bit Switch Designed at Microwave Frequency Range

P. Debnath, A. Deyasi, A. Sarkar
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引用次数: 1

Abstract

Insertion loss, isolation factor and return loss of one-bit RF MEMS switch designed at higher microwave frequency ranges is numerically measured for computation of up-state and down-state capacitance. SiO2 is the material considered for design purpose and simulation is performed over the entire microwave frequency range in order to investigate the position of maximum loss (peak point). Overlap cross-sectional area is varied over the possible fabrication range, and losses are measured for both actuated as well as unactuated states of the device over the varying overlap region. Both up and down state capacitances are measured which are higher with increase of active area. Return loss of −50 dB is observed for unactuated state whereas it becomes very low (~ −7.5 dB) for actuated device. Also for down state capacitance measurement, isolation increases upto −40 dB. Results are very useful for phase-shifter design at microwave spectrum.
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微波频率下射频MEMS位开关上、下电容测量
对高微波频率下设计的1位射频MEMS开关的插入损耗、隔离因数和回波损耗进行了数值测量,计算了开关的上、下状态电容。SiO2是用于设计目的的材料,在整个微波频率范围内进行模拟,以研究最大损耗(峰值点)的位置。重叠横截面积在可能的制造范围内变化,并且在不同的重叠区域内测量器件的驱动和非驱动状态的损耗。上下状态电容均随有源面积的增大而增大。非驱动状态下的回波损耗为- 50 dB,而驱动状态下的回波损耗非常低(~ - 7.5 dB)。同样,对于下降状态电容测量,隔离度增加到- 40 dB。研究结果对微波谱移相器的设计具有重要的指导意义。
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