F. Schmuckle, A. Jentzsch, C. Gassler, P. Marschall, D. Geiger, W. Heinrich
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引用次数: 17
Abstract
A hot-via flip-chip interconnect for the 40 GHz band is presented. The chip in-out cell includes on-wafer probing pads and is minimized with regard to size. An optimized design shows excellent performance with 10 GHz of bandwidth and -40 dB isolation. This demonstrates the potential of the hot-via approach in mm-wave applications.
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