Conductivity modulation lag during IGBT turn on in resonant converter applications

I. Widjaja, A. Kurnia, D. Divan, K. Shenai
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引用次数: 8

Abstract

A novel physical mechanism is identified in the IGBT t u n on waveforms when switched in resonant converter applications. Dynamic saturation of the forward voltage drop Vce has been observed in excess of 1OV followed by voltage spikes under varying di/dt switching conditions. This value of Vce is far in excess of that due to inductance caused by the package and module substrate assembly. The additional di/dt induced voltage results from the inductive effect within the intrinsic device. As the device is being turned on, the rate of conductivity modulation of the drift region lags behind the rate at which the excess carriers are removed. Computer simulations using an advanced 2D mixed-mode circuit simulator suggest significant. amount of drift region " conductivity modulation lag 'I. In this simulator, 2D device carrier dynamics is calculated in an actual circuit switching environment, and thus, allows for the study of plasma spreading as the circuit boundary conditions are changed. This mechanism results in excessive turn on power loss in fast-switching IGBT's where device speed is increased using carrier lifetime killers. A circuit simulation model is developed that accurately predicts the turn on waveforms.
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谐振变换器中IGBT导通时电导率调制滞后
在谐振变换器中,IGBT在开关时对波形的影响是一种新的物理机制。在不同的di/dt开关条件下,观察到正向压降Vce在超过1OV时的动态饱和,随后出现电压尖峰。这个Vce值远远超过由封装和模块基板组装引起的电感值。附加的di/dt感应电压是由本征器件内部的感应效应产生的。当器件被打开时,漂移区的电导率调制速率落后于多余载流子被移除的速率。使用先进的二维混合模式电路模拟器进行计算机模拟表明了重要的意义。在这个模拟器中,二维器件载流子动力学是在实际的电路开关环境中计算的,因此,可以研究随着电路边界条件的变化等离子体的扩散。这种机制导致在快速开关IGBT中,使用载波寿命杀手来增加器件速度,从而导致过度的导通功率损耗。建立了能准确预测导通波形的电路仿真模型。
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