{"title":"Mcm-L Product Development Process for Low-Cost Mcms","authors":"P. Thompson","doi":"10.1109/ICMCM.1994.753588","DOIUrl":null,"url":null,"abstract":"In Motorola's experience with commercial MCM customers, system size and cost reduction are the largest factors for interest in MCMs. Performance improvement is generally of secondary interest. Development and qualification can add significantly to the total cost of an MCM, so in addition to the normal desire to provide reliable products, the cost of doing so has gained increased importance. A new product introduction (NPI) process for low-cost MCMs has been implemented to rapidly provide cost-effective, reliable MCM solutions for cost-sensitive MCM users. The NPI process is based on three attributes: leverage single chip package (SCP) experience and technology, perform product family qualifications and use only previously qualified silicon in MCMs. Application of the NPI process to the development and qualification of the 28mm MCML/sup TM/ Series package is presented in this paper.","PeriodicalId":363745,"journal":{"name":"Proceedings of the International Conference on Multichip Modules","volume":"81 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-04-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the International Conference on Multichip Modules","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMCM.1994.753588","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
In Motorola's experience with commercial MCM customers, system size and cost reduction are the largest factors for interest in MCMs. Performance improvement is generally of secondary interest. Development and qualification can add significantly to the total cost of an MCM, so in addition to the normal desire to provide reliable products, the cost of doing so has gained increased importance. A new product introduction (NPI) process for low-cost MCMs has been implemented to rapidly provide cost-effective, reliable MCM solutions for cost-sensitive MCM users. The NPI process is based on three attributes: leverage single chip package (SCP) experience and technology, perform product family qualifications and use only previously qualified silicon in MCMs. Application of the NPI process to the development and qualification of the 28mm MCML/sup TM/ Series package is presented in this paper.
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