{"title":"New fabrication technology of polymer/metal lamination and its application in electronic packaging","authors":"T. Suga, A. Takahashi, K. Saijo, S. Oosawa","doi":"10.1109/POLYTR.2001.973251","DOIUrl":null,"url":null,"abstract":"A new fabrication technology for lamination between LCP (liquid crystalline polymer)and copper is presented. The method is based on a surface activation process prior to the clad bonding process. The fabrication conditions and the microstructure of the bonded interface as well as the mechanism of the bonding are discussed with respect to various experimental results. Some practical applications of the new clad materials in electronic packaging are also presented.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"108 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"16","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/POLYTR.2001.973251","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 16
Abstract
A new fabrication technology for lamination between LCP (liquid crystalline polymer)and copper is presented. The method is based on a surface activation process prior to the clad bonding process. The fabrication conditions and the microstructure of the bonded interface as well as the mechanism of the bonding are discussed with respect to various experimental results. Some practical applications of the new clad materials in electronic packaging are also presented.
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