Multifunction chip set for T/R module receive path

D. Willems, I. Bahl, M. Pollman, J. Jorgenson, E. Griffin, M. Coluzzi, S. Tantod, C. Andricos
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引用次数: 2

Abstract

The design and test results for multifunction monolithic microwave ICs (MMICs) for C-band transmit/receive (T/R) modules are presented. This small-signal chip set contains the entire receive path (5 stages of amplification and 10 passive devices) in just three chips. These ICs, fabricated with the multifunctional self-aligned gate (MSAG) process, demonstrate a high level of integration, excellent performance. and a good yield. The variable-gain low-noise amplifier has a 30+or-1-dB gain, and a 2.5-dB noise figure, the phase shifter single-pole, double-throw (SPDT) switch has an 8+or-1-dB loss, and the buffer amplifier has a 6.5+or-0.2-dB gain and a 3.5-dB noise figure. Average yield for these circuits was 40% or better.<>
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用于收发模块接收路径的多功能芯片组
介绍了用于c波段收发(T/R)模块的多功能单片微波集成电路(mmic)的设计和测试结果。这个小信号芯片集包含整个接收路径(5级放大和10个无源器件)在仅仅三个芯片。这些集成电路采用多功能自对准栅极(MSAG)工艺制造,具有高集成度,优异的性能。而且产量也很高。可变增益低噪声放大器的增益为30+或1 db,噪声系数为2.5 db;移相器单极双掷(SPDT)开关的损耗为8+或1 db;缓冲放大器的增益为6.5+或0.2 db,噪声系数为3.5 db。这些电路的平均成品率为40%或更高。
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Multifunction chip set for T/R module receive path Monolithic Ka band VCO using quarter micron GaAs MESFETs and integrated high-Q varactors A single chip 2.20 GHz T/R module 5-100 GHz InP CPW MMIC 7-section distributed amplifier A high power 2-18 GHz T/R switch
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