Through-hole less microstrip line to waveguide transition with quarter-wavelength open stubs

Abstract

A through-hole less microstrip line to waveguide transition is proposed in this paper. Conventional transitions are required through-holes in order to prevent unwanted emission in the substrate. However, the product cost of the transition is increased by making through-holes. In addition, the through-holes will be broken by heat deformation of the dielectric so that the characteristics of the transition may be deteriorated. Therefore, this paper replaces through-holes to quarter-wavelength open stubs in the transition. In this paper, our proposed transition is designed and the characteristics of that are analyzed. Moreover, the characteristics of our proposed transition are compared with the characteristics of the conventional one. The results show that our proposed transition can maintain the same characteristics as the conventional transition, reduce the product cost and increase the reliability of the transition for heat.