A formulation to optimize stress testing

H. Chan
{"title":"A formulation to optimize stress testing","authors":"H. Chan","doi":"10.1109/ECTC.1994.367502","DOIUrl":null,"url":null,"abstract":"Although hard-defects may be detectable in factory tests, weak products may exhibit failures or degrade only under certain stress conditions. Without stress testing, these weak products may often be shipped to customers causing early failures in the field. A candidate product for stress testing needs to get more business benefits to more than pay off the cost of stress testing. A business measure of the success of the stress testing program is the net benefit, which is the total benefit minus the total cost of the program. The optimum stress testing program maximizes this net benefit. A given unit of a product has a probability of encountering a maximum stress X during its product life. It also has a probability of possessing a product yield strength Y, which is the maximum stress the unit can survive without failure. While the strength distribution depends on the design and manufacture processes, the distribution of the maximum stress is determined by the customers' environment. A convenient picture is to construct the contour map of the joint probability distribution of X and Y. In this contour map, a unit falling in the YX region will not result in field failure. The effects of stress testing at a given maximum stress level, X/sup ST/, are shown by a dividing line on the product strength into stress test failure and stress test pass. The units in the contour map are then divided into four regions by the Y=X line and the X/sup ST/ line. The cost and benefits may now be evaluated for each region. Now the value of X/sup ST/ is a free parameter that determines the relative size of each region. The second free parameter is the fraction of units going through stress testing. These two parameters may be adjusted to maximize the net benefit of the stress testing program.<<ETX>>","PeriodicalId":344532,"journal":{"name":"1994 Proceedings. 44th Electronic Components and Technology Conference","volume":"14 7","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1994 Proceedings. 44th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1994.367502","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6

Abstract

Although hard-defects may be detectable in factory tests, weak products may exhibit failures or degrade only under certain stress conditions. Without stress testing, these weak products may often be shipped to customers causing early failures in the field. A candidate product for stress testing needs to get more business benefits to more than pay off the cost of stress testing. A business measure of the success of the stress testing program is the net benefit, which is the total benefit minus the total cost of the program. The optimum stress testing program maximizes this net benefit. A given unit of a product has a probability of encountering a maximum stress X during its product life. It also has a probability of possessing a product yield strength Y, which is the maximum stress the unit can survive without failure. While the strength distribution depends on the design and manufacture processes, the distribution of the maximum stress is determined by the customers' environment. A convenient picture is to construct the contour map of the joint probability distribution of X and Y. In this contour map, a unit falling in the YX region will not result in field failure. The effects of stress testing at a given maximum stress level, X/sup ST/, are shown by a dividing line on the product strength into stress test failure and stress test pass. The units in the contour map are then divided into four regions by the Y=X line and the X/sup ST/ line. The cost and benefits may now be evaluated for each region. Now the value of X/sup ST/ is a free parameter that determines the relative size of each region. The second free parameter is the fraction of units going through stress testing. These two parameters may be adjusted to maximize the net benefit of the stress testing program.<>
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
优化压力测试的配方
虽然在工厂测试中可以检测到硬缺陷,但弱产品仅在某些应力条件下才可能出现故障或退化。如果没有压力测试,这些薄弱的产品可能经常会被交付给客户,导致早期的故障。压力测试的候选产品需要获得更多的业务利益,而不仅仅是偿还压力测试的成本。压力测试计划成功的商业度量是净收益,它是总收益减去计划的总成本。最佳的压力测试程序可以最大化这一净收益。给定的产品单元在其产品寿命期间有可能遇到最大应力X。它还具有产品屈服强度Y的概率,这是单元可以在不失效的情况下承受的最大应力。虽然强度分布取决于设计和制造过程,但最大应力的分布取决于客户的环境。一种方便的方法是构造X与y的联合概率分布等高线图。在该等高线图中,落在YX区域的单元不会导致现场故障。在给定的最大应力水平(X/sup ST/)下,应力测试的效果由产品强度分为应力测试失败和应力测试通过的分界线表示。等高线地图中的单位然后被Y=X线和X/sup ST/线划分为四个区域。现在可以对每个地区的成本和收益进行评估。现在X/sup ST/的值是一个自由参数,它决定了每个区域的相对大小。第二个自由参数是通过压力测试的单位的比例。可以调整这两个参数,以使压力测试程序的净效益最大化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Development of a tapeless lead-on-chip (LOC) package A photosensitive-BCB on laminate technology (MCM-LD) A PC program that generates a model of the parasitics for IC packages Compact planar optical devices (CPODs) by CVD technology Predicting solder joint shape by computer modeling
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1