{"title":"Physics of deformation and fracture at the interface of amorphous and crystalline metal alloys","authors":"I. Ushakov, Ayur D. Oshorov, I. S. Safronov","doi":"10.17212/1727-2769-2023-2-7-15","DOIUrl":null,"url":null,"abstract":"This study is aimed at studying the physical mechanisms of deformation and fracture in the region of the boundary between amorphous and crystalline alloys at low temperatures. Experimental studies were carried out on composite samples with the solder PОСК 50-18 at different temperatures (152 К, 219 К and 293 K). The results showed that when the temperature decreases, the strength and ductility of the material decrease, which can lead to the formation of defects and cracks. Composite samples with the solder PОСК 50-18 behave quite stably at low temperatures, but still deteriorate their mechanical properties when the temperature drops to 219 К. The results obtained can be used for the development of new materials and technologies for joining amorphous and crystalline alloys for low-temperature applications.","PeriodicalId":448354,"journal":{"name":"Proceedings of the Russian higher school Academy of sciences","volume":"27 5","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-06-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the Russian higher school Academy of sciences","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.17212/1727-2769-2023-2-7-15","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
This study is aimed at studying the physical mechanisms of deformation and fracture in the region of the boundary between amorphous and crystalline alloys at low temperatures. Experimental studies were carried out on composite samples with the solder PОСК 50-18 at different temperatures (152 К, 219 К and 293 K). The results showed that when the temperature decreases, the strength and ductility of the material decrease, which can lead to the formation of defects and cracks. Composite samples with the solder PОСК 50-18 behave quite stably at low temperatures, but still deteriorate their mechanical properties when the temperature drops to 219 К. The results obtained can be used for the development of new materials and technologies for joining amorphous and crystalline alloys for low-temperature applications.