{"title":"AC hot-carrier effect under mechanical stress (MOSFET)","authors":"A. Hamada, E. Takeda","doi":"10.1109/VLSIT.1992.200667","DOIUrl":null,"url":null,"abstract":"An AC hot-carrier effect observed under uniaxial mechanical stress is discussed. The effect is due to trap level lowering induced by compressive mechanical stress. In channel hot electron injection, the trap level lowering results in an electron detrapping and a reduction of surface state generation which is not observed for DC stress. These results are significant for nanoscale device design.<<ETX>>","PeriodicalId":404756,"journal":{"name":"1992 Symposium on VLSI Technology Digest of Technical Papers","volume":"24 3","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-06-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1992 Symposium on VLSI Technology Digest of Technical Papers","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSIT.1992.200667","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6
Abstract
An AC hot-carrier effect observed under uniaxial mechanical stress is discussed. The effect is due to trap level lowering induced by compressive mechanical stress. In channel hot electron injection, the trap level lowering results in an electron detrapping and a reduction of surface state generation which is not observed for DC stress. These results are significant for nanoscale device design.<>
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