R. Kandasamy, Pengfei Liu, H. Feng, T. Wong, K. Toh
{"title":"Spray cooling enhancement studies using dielectric liquid","authors":"R. Kandasamy, Pengfei Liu, H. Feng, T. Wong, K. Toh","doi":"10.1109/EPTC.2018.8654446","DOIUrl":null,"url":null,"abstract":"An experimental investigation on closed-loop single nozzle spray cooling with and without the presence of non-condensable gas in the system was carried out. A circular bare copper heated surface of area 3.14 cm2 was spray cooled with dielectric liquid PF-5060 and FC-3284 in this study. Results showed that spray cooling without non-condensable gas showed a lower surface temperature for the same heat flux compared to that with non-condensable gas.","PeriodicalId":360239,"journal":{"name":"2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)","volume":"244 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2018.8654446","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
An experimental investigation on closed-loop single nozzle spray cooling with and without the presence of non-condensable gas in the system was carried out. A circular bare copper heated surface of area 3.14 cm2 was spray cooled with dielectric liquid PF-5060 and FC-3284 in this study. Results showed that spray cooling without non-condensable gas showed a lower surface temperature for the same heat flux compared to that with non-condensable gas.
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