Fast Power-Temperature Cycling of BEOL Test Structures for Power Devices

Abstract

Power semiconductors used in automotive applications are exposed to higher temperatures and higher currents than devices used in consumer products. The qualification of these devices includes power-temperature cycling (PTC) stresses on fully integrated structures. The PTC stresses are time consuming and can require device redesign if fails are observed. In this report, we show that PTC stresses using simple test structures can be used to quickly test the interconnects and wire bonds, and thereby highlight weak links in the process.