Fatigue Strength of BGA Type Solder Joints between Package and Printed Wiring Board of Portable Device

Jsme International Journal Series A-solid Mechanics and Material Engineering Pub Date : 2006-04-15 DOI:10.1299/JSMEA.49.220

K. Nagano, A. Yaguchi, T. Terasaki, Kenichi Yamamoto

{"title":"Fatigue Strength of BGA Type Solder Joints between Package and Printed Wiring Board of Portable Device","authors":"K. Nagano, A. Yaguchi, T. Terasaki, Kenichi Yamamoto","doi":"10.1299/JSMEA.49.220","DOIUrl":null,"url":null,"abstract":"Solder joints between a package and a printed wiring board (PWB) of a portable electronic device sustain heat cycling as a result of power on-off operations, cyclic bending by key pad operation, and impact bending by dropping. Therefore, heat cycling, cyclic bending, and cyclic impact bending tests were conducted on the ball grid array solder joints between a chip scale package and a PWB. The evaluated solders were Sn-3Ag-0.5Cu and Sn-37Pb. The tests showed that the life cycles of the Sn-3Ag-0.5Cu solder joints for the heat cycling and cyclic bending tests were approximately twice those of the Sn-37Pb solder joints. For the cyclic impact bending test, however, the life cycle of the Sn-3Ag-0.5Cu joint under large strain was smaller than that of the Sn-37Pb solder joint because of interfacial crack growth between the solder and the PWB. Finally, fatigue lives of the joints were compared with crack initiation and failure lives of plain specimens by calculating local strain ranges in the joints by elastic-plastic finite element analysis.","PeriodicalId":170519,"journal":{"name":"Jsme International Journal Series A-solid Mechanics and Material Engineering","volume":"24 8","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Jsme International Journal Series A-solid Mechanics and Material Engineering","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1299/JSMEA.49.220","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 10

Abstract

Solder joints between a package and a printed wiring board (PWB) of a portable electronic device sustain heat cycling as a result of power on-off operations, cyclic bending by key pad operation, and impact bending by dropping. Therefore, heat cycling, cyclic bending, and cyclic impact bending tests were conducted on the ball grid array solder joints between a chip scale package and a PWB. The evaluated solders were Sn-3Ag-0.5Cu and Sn-37Pb. The tests showed that the life cycles of the Sn-3Ag-0.5Cu solder joints for the heat cycling and cyclic bending tests were approximately twice those of the Sn-37Pb solder joints. For the cyclic impact bending test, however, the life cycle of the Sn-3Ag-0.5Cu joint under large strain was smaller than that of the Sn-37Pb solder joint because of interfacial crack growth between the solder and the PWB. Finally, fatigue lives of the joints were compared with crack initiation and failure lives of plain specimens by calculating local strain ranges in the joints by elastic-plastic finite element analysis.

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

便携式设备封装与印刷配线板间BGA型焊点的疲劳强度

便携式电子设备的封装和印刷配线板(PWB)之间的焊点通过电源开关操作、键盘操作的循环弯曲和跌落的冲击弯曲来维持热循环。为此，对芯片级封装与PWB之间的球栅阵列焊点进行了热循环、循环弯曲和循环冲击弯曲试验。评价的焊料为Sn-3Ag-0.5Cu和Sn-37Pb。试验表明，Sn-3Ag-0.5Cu焊点在热循环和循环弯曲试验中的寿命周期约为Sn-37Pb焊点的2倍。而在循环冲击弯曲试验中，由于焊料与PWB之间的界面裂纹扩展，Sn-3Ag-0.5Cu接头在大应变下的寿命周期小于Sn-37Pb焊点。最后，通过弹塑性有限元分析计算节点局部应变范围，将节点的疲劳寿命与平面试件的起裂寿命和破坏寿命进行比较。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文去求助

来源期刊

Jsme International Journal Series A-solid Mechanics and Material Engineering

自引率

0.00%

发文量