On Improving Defect Coverage of Stuck-at Fault Tests

K. Miyase, Kenta Terashima, S. Kajihara, X. Wen, S. Reddy
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引用次数: 8

Abstract

Recently design for manufacturability (DFM) has been required to achieve higher process yield. Information obtained from silicon by testing and/or fault analysis is sometimes fed back for redesign of VLSI circuits. In this paper we propose a method to maximize defect coverage of a test set initially generated for stuck-at faults in a full scan sequential circuit by using feed back information from fault analysis. If a test set for more complex faults than stuck-at faults is generated, higher defect coverage would be obtained. Such a test set, however, would have a large number of test vectors, and hence the test costs would go up. The proposed method improves defect coverage of the test set by not adding new test vectors but modifying test vectors with the information obtained from fault analysis. Therefore there are no negative impacts on test data volume and test application time. The initial fault coverage for stuck-at faults of the test set is guaranteed with modified test vectors. In this paper we focus on detecting as many as possible non-feedback AND/OR-type bridging faults. Experimental results show that the proposed method significantly decreases the number of non-feedback AND/OR-type bridging faults undetected by a test set generated for stuck-at faults
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提高卡在故障测试的缺陷覆盖率
近年来,对可制造性设计(DFM)提出了更高的工艺良率要求。通过测试和/或故障分析从硅中获得的信息有时反馈给VLSI电路的重新设计。本文提出了一种利用故障分析反馈信息最大化全扫描顺序电路中卡滞故障初始测试集缺陷覆盖率的方法。如果生成一个比卡在故障更复杂的故障的测试集,将获得更高的缺陷覆盖率。然而,这样的测试集会有大量的测试向量,因此测试成本会上升。该方法不增加新的测试向量,而是利用故障分析得到的信息对测试向量进行修改,从而提高了测试集的缺陷覆盖率。因此,对测试数据量和测试应用时间没有负面影响。修正后的测试向量保证了测试集卡滞故障的初始故障覆盖率。本文的重点是检测尽可能多的非反馈与或型桥接故障。实验结果表明,该方法显著减少了非反馈与/或型桥接故障的数量,而非反馈与/或型桥接故障无法通过卡滞故障生成的测试集检测出来
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