Snapback by Hot Filament

J. Yeh, F. Chen, D. Chao, Wen-Han Wang, Yi-Chan Chen, Chain-Ming Lee, M. Tsai, M. Kao
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引用次数: 4

Abstract

A simulation procedure using the conventional thermal-electric finite element method for the phase change memory has been developed. By introducing a defect on the amorphous chalcogenide of a reset phase change memory, the snapback by hot filament due to thermal runaway has been investigated by the numerical simulations with three-dimensional model.
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Hot Filament的Snapback
采用传统的热电有限元法对相变存储器进行了仿真。通过在复位相变存储器的非晶硫化物上引入缺陷,采用三维模型对热灯丝因热失控引起的回弹现象进行了数值模拟研究。
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