Degradation of single-quantum well InGaN green light emitting diodes under high electrical stress

D. Barton, M. Osiński, P. Perlin, P. Eliseev, J. Lee
{"title":"Degradation of single-quantum well InGaN green light emitting diodes under high electrical stress","authors":"D. Barton, M. Osiński, P. Perlin, P. Eliseev, J. Lee","doi":"10.1109/RELPHY.1998.670460","DOIUrl":null,"url":null,"abstract":"We performed a degradation study of high-brightness Nichia single-quantum well AlGaN-InGaN-GaN green light-emitting diodes (LEDs). The devices were subjected to high current electrical stress with current pulse amplitudes between 1 A and 7 A and voltages between 10 V and 70 V with a pulse length of 100 ns and a 1 kHz repetition rate. The study showed that when the current amplitude was increased above 6 A, a fast (about 1 s) degradation occurred, with a visible discharge between the p- and n-type electrodes. Subsequent failure analysis revealed severe damage to the metal contacts which lead to the formation of shorts in the surface plane of the diode. For currents smaller than 6 A, a slow degradation was observed as a decrease in optical power and an increase in the reverse current leakage. After between 24 and 100 hours however, a rapid degradation occurred which was similar to the rapid degradation observed at higher currents. The failure analysis results indicate that the degradation process begins with carbonization of the plastic encapsulation material on the diode surface, which leads to the formation of a conductive path across the LED and subsequently to the destruction of the diode itself.","PeriodicalId":196556,"journal":{"name":"1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173)","volume":"51 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.1998.670460","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 11

Abstract

We performed a degradation study of high-brightness Nichia single-quantum well AlGaN-InGaN-GaN green light-emitting diodes (LEDs). The devices were subjected to high current electrical stress with current pulse amplitudes between 1 A and 7 A and voltages between 10 V and 70 V with a pulse length of 100 ns and a 1 kHz repetition rate. The study showed that when the current amplitude was increased above 6 A, a fast (about 1 s) degradation occurred, with a visible discharge between the p- and n-type electrodes. Subsequent failure analysis revealed severe damage to the metal contacts which lead to the formation of shorts in the surface plane of the diode. For currents smaller than 6 A, a slow degradation was observed as a decrease in optical power and an increase in the reverse current leakage. After between 24 and 100 hours however, a rapid degradation occurred which was similar to the rapid degradation observed at higher currents. The failure analysis results indicate that the degradation process begins with carbonization of the plastic encapsulation material on the diode surface, which leads to the formation of a conductive path across the LED and subsequently to the destruction of the diode itself.
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高电应力下单量子阱InGaN绿色发光二极管的退化
对高亮度Nichia单量子阱AlGaN-InGaN-GaN绿色发光二极管(led)进行了降解研究。该器件承受大电流电应力,电流脉冲幅值在1 ~ 7 A之间,电压在10 ~ 70 V之间,脉冲长度为100 ns,重复频率为1 kHz。研究表明,当电流幅度增加到6 A以上时,发生了快速(约1 s)的退化,p型电极和n型电极之间出现了可见的放电。随后的故障分析表明,金属触点严重损坏,导致二极管表面形成短路。对于小于6 A的电流,观察到光功率下降和反向漏电流增加的缓慢退化。然而,在24至100小时之间,发生了快速降解,这与在更高电流下观察到的快速降解相似。失效分析结果表明,降解过程始于二极管表面塑料封装材料的碳化,这导致在LED上形成导电路径,随后导致二极管本身的破坏。
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