Polysilicon microstructures

Abstract

The sacrificial etch technology for fabricating free-standing three-dimensional microstructures in polysilicon has been successfully implemented. A variety of techniques for reducing the intrinsic compressive stress have been employed in fabricating low stress structures. Low-temperature-deposited microcrystalline polysilicon and polysilicon deposited over doped oxide were found to have low intrinsic stress, without additional annealing. A simple technique for obtaining additional compliance in diaphragms is described. Anisotropically etched submicron fibers and plastically deformed polysilicon shells are some of the unusual devices that have been obtained.<>