Micromachining and nanoprocessing of GaN/Silicon for SAW and UV photodetector manufacturing

A. Muller, G. Konstantinidis, D. Neculoiu, A. Dinescu, M. Andrulidaki, A. Stavrinidis, A. Cismaru, A. Stefanescu, M. Carp, C. Anton, A. Muller, R. Gavrila, D. Dascalu
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Abstract

The paper presents the manufacturing and the characterization of two novel devices on GaN/Si. The first device is a SAW structure for the GHz frequency range manufactured using nanolithografic techniques on GaN. Fingers and intedigits spacing 300nm wide have been successful developed in a single metal PMMA layer. An operating frequency close to 4 GHz has been obtained. For the second device, a membrane supported MSM UV photodetector on GaN, both micromachining techniques and nanolithography have been used. The MSM interdigitated structure of the photodetector had 500nm wide fingers/spacings. A very high responsivity (about 10 A/W for 6V) and the very low dark current (<1pA for V=3V) have been obtained.
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用于SAW和UV光电探测器制造的GaN/硅的微加工和纳米加工
本文介绍了两种新型GaN/Si器件的制备和表征。第一个器件是GHz频率范围的SAW结构,使用GaN上的纳米光刻技术制造。在单个金属PMMA层中成功地开发了间距为300nm的手指和手指间。已获得接近4ghz的工作频率。第二种器件是氮化镓上的膜支撑MSM紫外光电探测器,采用了微加工技术和纳米光刻技术。MSM交叉指状结构的光电探测器具有500nm宽指间距。获得了非常高的响应率(6V时约为10 A/W)和非常低的暗电流(V=3V时<1pA)。
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