The effect of cyclic thermal loading rate on the mechanical behavior of micro-bumps in CoWoS package

H. Bao, Tianhan Liu, Minjie Ning, Weiping Du, Yufeng Liu, Zongbei Dai
{"title":"The effect of cyclic thermal loading rate on the mechanical behavior of micro-bumps in CoWoS package","authors":"H. Bao, Tianhan Liu, Minjie Ning, Weiping Du, Yufeng Liu, Zongbei Dai","doi":"10.1109/EPTC56328.2022.10013194","DOIUrl":null,"url":null,"abstract":"Micro-bumps are one kind of the CoWoS package structures. Finite element analysis (FEA) simulation was used to more accurately investigate micro-bumps mechanical behaviour (e.g. stress-strain state, lifetime prediction) at different cyclic thermal loading rates (mimic the thermal cycling and thermal shock in JEDEC JESD22 A106B/A104E conditions). Considering the difference in thermal expansion coefficients of each material in the CoWoS structure, the material properties of each structure were fed into the simulation. The results showed that the cyclic thermal loading rate influences the maximum equivalent strain, which is larger at slower thermal loading rates. However, the maximum equivalent stress and the maximum strain energy density are larger at faster thermal loads. In addition, the regions with the maximum equivalent stress and the maximum strain energy density normally are located closed to the most distal part of the micro-bumps. Finally, this paper also presents a lifetime prediction for micro-bumps by Engelmaier model, which could be a reference only. The lifetime prediction indicated that faster thermal loading rates lead to micro-bumps greater stress-strain concentration, which in turn reduce lifetime.","PeriodicalId":163034,"journal":{"name":"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)","volume":"68 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-12-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC56328.2022.10013194","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

Micro-bumps are one kind of the CoWoS package structures. Finite element analysis (FEA) simulation was used to more accurately investigate micro-bumps mechanical behaviour (e.g. stress-strain state, lifetime prediction) at different cyclic thermal loading rates (mimic the thermal cycling and thermal shock in JEDEC JESD22 A106B/A104E conditions). Considering the difference in thermal expansion coefficients of each material in the CoWoS structure, the material properties of each structure were fed into the simulation. The results showed that the cyclic thermal loading rate influences the maximum equivalent strain, which is larger at slower thermal loading rates. However, the maximum equivalent stress and the maximum strain energy density are larger at faster thermal loads. In addition, the regions with the maximum equivalent stress and the maximum strain energy density normally are located closed to the most distal part of the micro-bumps. Finally, this paper also presents a lifetime prediction for micro-bumps by Engelmaier model, which could be a reference only. The lifetime prediction indicated that faster thermal loading rates lead to micro-bumps greater stress-strain concentration, which in turn reduce lifetime.
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循环热加载速率对CoWoS封装微凸点力学行为的影响
微凸点是CoWoS包结构的一种。采用有限元分析(FEA)模拟,更准确地研究了不同循环热加载速率下微凸点的力学行为(如应力应变状态、寿命预测)(模拟JEDEC JESD22 A106B/A104E条件下的热循环和热冲击)。考虑到cocos结构中每种材料的热膨胀系数的差异,将每种结构的材料性能输入到模拟中。结果表明:循环热加载速率对最大等效应变有影响,且在较慢的热加载速率下最大等效应变较大;然而,在更快的热载荷下,最大等效应力和最大应变能密度更大。此外,最大等效应力和最大应变能密度的区域通常位于微凸起的最远端。最后,本文还提出了用Engelmaier模型预测微碰撞的寿命,仅供参考。寿命预测表明,更快的热加载速率会导致微凸起,应力应变集中程度更高,从而降低寿命。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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