{"title":"A new multichip-on-silicon packaging scheme with integrated passive components","authors":"L. Guérin, R. Sachot, M. Dutoit","doi":"10.1109/MCMC.1996.510772","DOIUrl":null,"url":null,"abstract":"A new multichip-on-silicon packaging scheme for microelectronic circuits, sensors and actuators is presented. Its main characteristics and advantages over other schemes are discussed. A description of some key fabrication steps is given. Finally, the realization and the characterization of passive integrated components such as inductors and capacitors are discussed.","PeriodicalId":126969,"journal":{"name":"Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-02-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1996.510772","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
A new multichip-on-silicon packaging scheme for microelectronic circuits, sensors and actuators is presented. Its main characteristics and advantages over other schemes are discussed. A description of some key fabrication steps is given. Finally, the realization and the characterization of passive integrated components such as inductors and capacitors are discussed.
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