{"title":"Performance and packaging implications of a MEMS based optical modulator for WDM fiber-to-the home systems","authors":"J. A. Walker, J. Ford, N. Basavanhally","doi":"10.1109/ECTC.1997.606232","DOIUrl":null,"url":null,"abstract":"Fabrication and performance of a silicon micromechanical optical modulator are presented. The modulator is expected to be very low cost due to the ease of providing fiber alignment to the large optical window of the device. Two packaging configurations are described which take advantage of this attribute.","PeriodicalId":339633,"journal":{"name":"1997 Proceedings 47th Electronic Components and Technology Conference","volume":"163 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-05-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1997 Proceedings 47th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1997.606232","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
Fabrication and performance of a silicon micromechanical optical modulator are presented. The modulator is expected to be very low cost due to the ease of providing fiber alignment to the large optical window of the device. Two packaging configurations are described which take advantage of this attribute.
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