{"title":"Temperature Evaluation in Microelectronics Structures Using Analog Networks","authors":"G. Rezek","doi":"10.1109/TPEP.1965.1136696","DOIUrl":null,"url":null,"abstract":"The steady-state and transient temperature elevations within a composite electronic or microelectronic structure can be analyzed by using a known method of converting a thermal system into an analog electrical system (Reference 1). The temoerature elevations are caused by heat generation and heat flow within an electronic structure and by convection and radiation heat flow away from the structure.","PeriodicalId":313371,"journal":{"name":"IEEE Transactions on Product Engineering and Production","volume":"47 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1965-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Product Engineering and Production","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TPEP.1965.1136696","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
The steady-state and transient temperature elevations within a composite electronic or microelectronic structure can be analyzed by using a known method of converting a thermal system into an analog electrical system (Reference 1). The temoerature elevations are caused by heat generation and heat flow within an electronic structure and by convection and radiation heat flow away from the structure.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
