Pub Date : 1965-04-01DOI: 10.1109/TPEP.1965.1136696
G. Rezek
The steady-state and transient temperature elevations within a composite electronic or microelectronic structure can be analyzed by using a known method of converting a thermal system into an analog electrical system (Reference 1). The temoerature elevations are caused by heat generation and heat flow within an electronic structure and by convection and radiation heat flow away from the structure.
{"title":"Temperature Evaluation in Microelectronics Structures Using Analog Networks","authors":"G. Rezek","doi":"10.1109/TPEP.1965.1136696","DOIUrl":"https://doi.org/10.1109/TPEP.1965.1136696","url":null,"abstract":"The steady-state and transient temperature elevations within a composite electronic or microelectronic structure can be analyzed by using a known method of converting a thermal system into an analog electrical system (Reference 1). The temoerature elevations are caused by heat generation and heat flow within an electronic structure and by convection and radiation heat flow away from the structure.","PeriodicalId":313371,"journal":{"name":"IEEE Transactions on Product Engineering and Production","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1965-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121752799","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1965-04-01DOI: 10.1109/TPEP.1965.1136694
G. Rezek
The cooling of miniaturized equipment is usually handled by forced air flow. An investigation was made of the merits of suction vs pressure cooling, to find an effective cooling design for a certain module assembly. This showed that suction cooling has certain advantages because of the air flow escape from the circuitry section to adjacent spaces. Its air flow pattern provides maximum air accretion at the air exit, which is a critical area. That suction cooling will minimize air temperatures in that area is qualitatively developed and then quantitatively analyzed.
{"title":"Suction vs. Pressure Forced Air Cooling","authors":"G. Rezek","doi":"10.1109/TPEP.1965.1136694","DOIUrl":"https://doi.org/10.1109/TPEP.1965.1136694","url":null,"abstract":"The cooling of miniaturized equipment is usually handled by forced air flow. An investigation was made of the merits of suction vs pressure cooling, to find an effective cooling design for a certain module assembly. This showed that suction cooling has certain advantages because of the air flow escape from the circuitry section to adjacent spaces. Its air flow pattern provides maximum air accretion at the air exit, which is a critical area. That suction cooling will minimize air temperatures in that area is qualitatively developed and then quantitatively analyzed.","PeriodicalId":313371,"journal":{"name":"IEEE Transactions on Product Engineering and Production","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1965-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129619094","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1965-04-01DOI: 10.1109/TPEP.1965.1136692
L. Neimann
{"title":"Technology in Electronics and International Trade","authors":"L. Neimann","doi":"10.1109/TPEP.1965.1136692","DOIUrl":"https://doi.org/10.1109/TPEP.1965.1136692","url":null,"abstract":"","PeriodicalId":313371,"journal":{"name":"IEEE Transactions on Product Engineering and Production","volume":"195 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1965-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122526262","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1965-04-01DOI: 10.1109/TPEP.1965.1136695
W. Czerwinski
{"title":"Compact Anehoic Chamber for Production Testing VHF Antennas","authors":"W. Czerwinski","doi":"10.1109/TPEP.1965.1136695","DOIUrl":"https://doi.org/10.1109/TPEP.1965.1136695","url":null,"abstract":"","PeriodicalId":313371,"journal":{"name":"IEEE Transactions on Product Engineering and Production","volume":"104 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1965-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131419855","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1964-04-01DOI: 10.1109/TPEP.1964.1136546
A. Levy
Proponents of the various miniaturization techniques claim advantages of: reduced size, weight and cost, and increased reliability. Reduction in size and weight are obvious consequences of the technique. Reduced cost and improved reliability are still to be proven. Shrinking electronic assemblies and sub-assemblies bring about interconnection problems to the packaging engineer. Interconnecting devices are not only a factor in weight and size, but are a weak link in the reliability chain of the complete electronic system. These matters are considered in this report with especial attention to multilayer printed circuit boards.
{"title":"Multilayer Printed Circuit Interconnection Techniques","authors":"A. Levy","doi":"10.1109/TPEP.1964.1136546","DOIUrl":"https://doi.org/10.1109/TPEP.1964.1136546","url":null,"abstract":"Proponents of the various miniaturization techniques claim advantages of: reduced size, weight and cost, and increased reliability. Reduction in size and weight are obvious consequences of the technique. Reduced cost and improved reliability are still to be proven. Shrinking electronic assemblies and sub-assemblies bring about interconnection problems to the packaging engineer. Interconnecting devices are not only a factor in weight and size, but are a weak link in the reliability chain of the complete electronic system. These matters are considered in this report with especial attention to multilayer printed circuit boards.","PeriodicalId":313371,"journal":{"name":"IEEE Transactions on Product Engineering and Production","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1964-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123708857","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1964-04-01DOI: 10.1109/TPEP.1964.1136547
Russell King
With the advent of the age of computers, electronic systems engineers turned their attention to the development of memory drums and spindles. Thus, they affiliated themselves, intentionally or otherwise, with the mechanical engineer and his wealth of knowledge in the field of machine design. System considerations and requirements are examined in addition to some of the primary technical areas, o Included are considerations of stability, rigidity, thermesthesia, environmental control and materials. In conclusion, philosophical reflections are expressed concerning the marriage of both fields of engineering in this application, and the attendant obligations of management.
{"title":"Memory Drums and Spindles","authors":"Russell King","doi":"10.1109/TPEP.1964.1136547","DOIUrl":"https://doi.org/10.1109/TPEP.1964.1136547","url":null,"abstract":"With the advent of the age of computers, electronic systems engineers turned their attention to the development of memory drums and spindles. Thus, they affiliated themselves, intentionally or otherwise, with the mechanical engineer and his wealth of knowledge in the field of machine design. System considerations and requirements are examined in addition to some of the primary technical areas, o Included are considerations of stability, rigidity, thermesthesia, environmental control and materials. In conclusion, philosophical reflections are expressed concerning the marriage of both fields of engineering in this application, and the attendant obligations of management.","PeriodicalId":313371,"journal":{"name":"IEEE Transactions on Product Engineering and Production","volume":"113 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1964-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132382279","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1964-04-01DOI: 10.1109/TPEP.1964.1136548
C. Botchek, C. Konzak, R. Nilan
Factors leading to design and construction of the 5500 curie Co60 facility are presented. Emphasis is placed on safety restrictions, research needs, and location limitations. Particular emphasis is given to design of linear isodose curves in the usable portion of the radiation field. Source geometry and intensity calculations as well as economy and feasibility problems are presented along with limited empirical field mapping data. Shielding calculations and their validity are demonstrated where applicable. The entire facility was provided with radiation safety features in the event of power failure. The electrical control circuit was designed for convenient and failsafe operation.
{"title":"Design of the CO60Facility at Washington State University","authors":"C. Botchek, C. Konzak, R. Nilan","doi":"10.1109/TPEP.1964.1136548","DOIUrl":"https://doi.org/10.1109/TPEP.1964.1136548","url":null,"abstract":"Factors leading to design and construction of the 5500 curie Co60 facility are presented. Emphasis is placed on safety restrictions, research needs, and location limitations. Particular emphasis is given to design of linear isodose curves in the usable portion of the radiation field. Source geometry and intensity calculations as well as economy and feasibility problems are presented along with limited empirical field mapping data. Shielding calculations and their validity are demonstrated where applicable. The entire facility was provided with radiation safety features in the event of power failure. The electrical control circuit was designed for convenient and failsafe operation.","PeriodicalId":313371,"journal":{"name":"IEEE Transactions on Product Engineering and Production","volume":"103 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1964-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134629753","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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