A Process for the Manufacture of Cost Competitive MCM Substrates

Abstract

This paper will deal with the issues involved with designing a substrate construction and it's associated manufacturing process for cost competitive applications. The substrate system consists of copper-polyimide high density 'layer-pairs' laminated together with an anisotropic conductive adhesive system. The resulting structure has theoretical routing densities on the order of 800 inches/in/sup 2/ per layer pair. The process of manufacturing is based upon roll-to-roll manufacturing techniques pioneered by flexible circuit manufacturers. The parts are kept in roll form until layer pair lamination, avoiding unnecessary handling and damage. However, the manufacturing process has been significantly revised to allow for successful manufacturing of MCMs.