High K polymer-ceramic nano-composite development, characterization, and modeling for embedded capacitor RF application

Y. Rao, J. Yue, C. Wong
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引用次数: 28

Abstract

Embedded capacitor technology can improve electrical performance and reduce assembly cost compared with traditional discrete capacitor technology. Polymer-ceramic composites have been of great interest as embedded capacitor material because they combine the processability of polymers with the desired electrical properties of ceramics. A novel nano-structure polymer-ceramic composite with very high dielectric constant (/spl epsiv//sub /spl tau//=150) has been developed in this work. RF application of embedded capacitors requires that insulating material have high dielectric constant in higher frequency (GHz), low leakage current, high breakdown voltage and high reliability. A set of electric tests have been conducted in this work to characterize the properties of the in house developed novel high dielectric constant polymer-ceramic nano-composite. Results show that this material has fair high dielectric constant in RF range, low electric leakage and high breakdown voltage. An embedded capacitor prototype with capacitance density of 35 nF/cm/sup 2/ has been manufactured using this nano-composite and spinning coating technology. The design of embedded passives is very important to its practical application. The commercial finite element software ANSYS and electric simulation software SPICE were used for the simulation of embedded capacitor performance in the RF range. This novel nano-composite can be used for the integral capacitors in the RF applications.
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高K聚合物-陶瓷纳米复合材料的开发,表征和建模的嵌入式电容器射频应用
与传统的离散电容技术相比,嵌入式电容技术可以提高电性能,降低装配成本。聚合物-陶瓷复合材料作为嵌入式电容器材料一直备受关注,因为它们将聚合物的可加工性与陶瓷的理想电性能结合在一起。本文研制了一种具有很高介电常数(/spl epsiv//sub /spl tau//=150)的新型纳米结构聚合物-陶瓷复合材料。嵌入式电容器的射频应用要求绝缘材料具有较高频率(GHz)的高介电常数、低漏电流、高击穿电压和高可靠性。本文通过一系列的电学测试,对自主研制的新型高介电常数聚合物-陶瓷纳米复合材料的性能进行了表征。结果表明,该材料在射频范围内具有较高的介电常数,漏电小,击穿电压高。利用这种纳米复合材料和纺丝涂层技术制备了电容密度为35nf /cm/sup 2/的嵌入式电容器原型。嵌入式无源的设计对其实际应用至关重要。利用商用有限元软件ANSYS和电气仿真软件SPICE对嵌入式电容在射频范围内的性能进行了仿真。这种新型纳米复合材料可用于射频应用中的积分电容器。
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