{"title":"An ATM Switching Module using MCM-C Technology","authors":"M. Yamada, Y. Otsuki, T. Kikuchi, H. Shibuya","doi":"10.1109/ICMCM.1994.753539","DOIUrl":null,"url":null,"abstract":"Multichip module (MCM) technology has been expected for high speed and high density packaging. Authors have developed an 8 x 8 ATM switching module with clock speed of 622 Mb/s and power consumption of 60 watts by using MCM-C technology with low temperature co-fired ceramic (LTCC) substrate. This paper will discuss MCM packaging technologies for an ATM switching module.","PeriodicalId":363745,"journal":{"name":"Proceedings of the International Conference on Multichip Modules","volume":"137 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-04-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the International Conference on Multichip Modules","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMCM.1994.753539","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
Multichip module (MCM) technology has been expected for high speed and high density packaging. Authors have developed an 8 x 8 ATM switching module with clock speed of 622 Mb/s and power consumption of 60 watts by using MCM-C technology with low temperature co-fired ceramic (LTCC) substrate. This paper will discuss MCM packaging technologies for an ATM switching module.
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