UV-Curable conductive adhesives for 3-D MID application

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) Pub Date : 2001-10-21 DOI:10.1109/POLYTR.2001.973277

A. Battermann, B. Gunther, H. Schafer

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引用次数: 2

Abstract

In this work a new type of isotropically conductive adhesive (ICA) for 3-D MID applications is presented. An extremely low value of ionic impurity content in the ICA is realised by using a cycloaliphatic epoxy resin (CAE). Together with a new developed thermal initiator the CAE will be cured by UV-rays and heat below 100/spl deg/C. To reach better mechanical behaviour, porous silver nanopowders (SNP) as conductive filler material, instead of conventional silver flakes, are introduced. In this way a considerable reduction of metal filler content is achieved at still acceptably low values of the electrical resistivity. It is shown that the curing regime and the mechanical properties are improved considerably, when using SNP/CAE composites as compared to ICA's based on epoxies with silver flakes. Therefore this new ICA is particularly suited for bonding substrates and components, which differ strongly with respect to their coefficient of thermal expansion.

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用于3-D MID应用的紫外光固化导电粘合剂

本文介绍了一种用于三维MID应用的新型各向同性导电胶(ICA)。通过使用环脂肪族环氧树脂(CAE)，实现了ICA中离子杂质含量的极低值。与新开发的热引发剂一起，CAE将通过紫外线和低于100/spl度/C的热量进行固化。为了获得更好的力学性能，引入了多孔纳米银粉(SNP)作为导电填充材料，而不是传统的银片。通过这种方法，在电阻率仍然可接受的低值下，实现了金属填料含量的相当大的减少。结果表明，与基于银片环氧树脂的ICA相比，SNP/CAE复合材料的固化状态和力学性能得到了显著改善。因此，这种新型ICA特别适用于热膨胀系数差异很大的衬底和组件的粘合。

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First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)

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