A Probabilistic approach to the robust thermo-mechanical analysis of Ball Grid Array Solder Joints

Ayda Halouani, A. Cherouat, M. Chaabane, M. Haddar
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Abstract

In this paper, we propose a metamodel called generalized polynomial chaos (gPC) to investigate the stochastic response of a ball grid array (PBGA) package under thermal cycle excitation. The shear strain is extracted in the presence of uncertain material and boundary condition parameters. A non-linear thermo-mechanical using Anand viscoplastic law was studied.
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球栅阵列焊点稳健性热力学分析的概率方法
本文提出了一个广义多项式混沌(gPC)元模型来研究热循环激励下球栅阵列(PBGA)封装的随机响应。在存在不确定材料和边界条件参数的情况下,提取剪切应变。利用Anand粘塑性规律研究了非线性热-力学问题。
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