M. P. Patkar, T. Chin, J. Woodall, M. Lundstrom, M. Melloch
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引用次数: 0
Abstract
Ohmic contacts with low specific contact resistivity are essential for contemporary electronic devices such as HBTs, lasers, LEDs, and MESFETs. Alloyed Au-Ge-Ni contacts for nGaAs and alloyed Au-Zn contacts for p-GaAs have been widely used in GaAs semiconductor devices, but alloyed contacts produce a rough interface with the semiconductor and hence, are not good optical reflectors. Devices like light emitting diodes, vertical cavity surface-emitting lasers, and solar cells, need ohrmc contacts that are also good optical reflectors. Optimizing the reflectivity and the resistivity of the back contact to such devices poses a considerable challenge. We have developed a new technology for forming non-alloyed ohmic contacts to nand p-GaAs using Asrich layers. As-rich GaAs epi layers can be produced by molecular beam epitaxy (MBE) using lower than normal growth temperatures. Due to the amphoteric nature of Si, the typical dopant for n-GaAs, achieving high n-type doping concentrations is difficult. Simple reaction kinetics show that N+/ Np x n?/n2.
具有低比接触电阻率的欧姆触点对于当代电子器件(如hbt,激光器,led和mesfet)至关重要。nGaAs合金Au-Ge-Ni触点和p-GaAs合金Au-Zn触点已广泛应用于GaAs半导体器件中,但合金触点与半导体产生粗糙的界面,因此不是良好的光学反射器。像发光二极管、垂直腔面发射激光器和太阳能电池这样的设备需要欧姆触点,这些触点也是良好的光学反射器。优化这类器件的背触点的反射率和电阻率是一个相当大的挑战。我们开发了一种利用富砷层形成非合金欧姆接触的新技术。利用分子束外延(MBE)可以在低于正常生长温度的条件下制备富砷化镓外延层。由于n-GaAs的典型掺杂物Si的两性性质,实现高n型掺杂浓度是困难的。简单反应动力学表明N+/ Np x N ?/n2。