The Superstrider Architecture: Integrating Logic and Memory Towards Non-Von Neumann Computing

S. Srikanth, T. Conte, E. Debenedictis, Jeanine E. Cook
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引用次数: 14

Abstract

We present a new non-von Neumann architecture, termed "Superstrider," predicated on no more than current projected improvements in semiconductor components and 3D manufacturing technologies, which should offer orders of magnitude advances in both energy efficiency and performance for many high-utility problem classes. The architecture is described, which is based on computing on row-wide memory words to accelerate sparse matrix algebraic operations that are normally implemented as scalar operations. A cycle-accurate simulation demonstrates potential performance improvements on existing High Bandwidth Memory (HBM) on the order of 50× that increases to 1000× or more when implemented using a fully integrated 3D technology and compared to a simple baseline. Further refinement may change these numbers, but the magnitude of the opportunity suggests further work.
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Superstrider架构:整合逻辑和记忆迈向非冯诺依曼计算
我们提出了一种新的非冯·诺伊曼架构,称为“超级黾”,基于半导体组件和3D制造技术的当前预计改进,这应该为许多高实用问题提供能源效率和性能方面的数量级进步。描述了基于行级存储字的计算来加速通常作为标量运算实现的稀疏矩阵代数运算的架构。周期精确的模拟表明,与简单的基线相比,使用完全集成的3D技术实现时,现有高带宽内存(HBM)的潜在性能提高了50倍,增加到1000倍或更多。进一步的改进可能会改变这些数字,但巨大的机会意味着进一步的工作。
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