{"title":"Correlation of experimental data with analytical predictions for GaAs FET in MMIC transmitter module in a subarray","authors":"M. Ibrahim, L. Paradis","doi":"10.1109/STHERM.1993.225318","DOIUrl":null,"url":null,"abstract":"Under the microwave/millimeter-wave monolithic integrated circuit (MIMIC) Phase 1 DARPA sponsored development program, a comprehensive integrated finite element model of a transmitter module which is based on MMIC technology was developed and exercised. This model determined FET channel temperature sensitivity to system and/or chip level design variations. Module thermal measurements were taken during operation of a brassboard assembly, and the results were compared with the predictions. These showed excellent agreement, validating the model and the approach. The authors describe the tests and compare the experimental and analytical results.<<ETX>>","PeriodicalId":369022,"journal":{"name":"[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-02-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"[1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.1993.225318","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Under the microwave/millimeter-wave monolithic integrated circuit (MIMIC) Phase 1 DARPA sponsored development program, a comprehensive integrated finite element model of a transmitter module which is based on MMIC technology was developed and exercised. This model determined FET channel temperature sensitivity to system and/or chip level design variations. Module thermal measurements were taken during operation of a brassboard assembly, and the results were compared with the predictions. These showed excellent agreement, validating the model and the approach. The authors describe the tests and compare the experimental and analytical results.<>
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