Linking Chip, Board, and System Test via Standards

M. Portolan, J. Rearick, Martin Keim
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引用次数: 5

Abstract

This paper introduces a standards-based framework which enables two types of test re-use: direct re-use of test patterns written for low-level components of a system, and access by high-level tests of test features embedded within the low-level components. The underlying mechanism for both is the encapsulation, retargeting, and transformation of test procedures through successive layers of hardware interfaces, as codified in two standards being developed by IEEE Working Groups (P1687.1 and P2654). Examples demonstrate the steps in the process and illustrate both the challenges and opportunities of this approach.
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通过标准连接芯片、板和系统测试
本文介绍了一个基于标准的框架,它支持两种类型的测试重用:直接重用为系统的低级组件编写的测试模式,以及通过高级测试访问嵌入在低级组件中的测试特性。两者的底层机制都是封装、重新定位,以及通过硬件接口的连续层对测试过程进行转换,正如IEEE工作组(P1687.1和P2654)正在开发的两个标准所编写的那样。示例演示了流程中的步骤,并说明了这种方法的挑战和机遇。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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