{"title":"Moisture induced package cracking in plastic encapsulated surface mount components during solder reflow process","authors":"R. Lin, E. Blackshear, P. Serisky","doi":"10.1109/RELPHY.1988.23431","DOIUrl":null,"url":null,"abstract":"The process compatibility and potential component reliability problems associated with surface-mount technology are investigated. Major reliability concerns observed during qualification of vendors' surface mount ICs are reported. Moisture-induced package cracking and its implication for the corrosion resistance of the package are discussed. The application of acoustic microscopy techniques such as scanning laser acoustic microscopy (SLAM) and C-mode scanning acoustic microscopy (C-SAM) for examining internal package cracking is described. The concept of threshold (safe) moisture level in a surface-mount package and the proper procedures for determining it are discussed.<<ETX>>","PeriodicalId":102187,"journal":{"name":"26th Annual Proceedings Reliability Physics Symposium 1988","volume":"85 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1988-04-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"82","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"26th Annual Proceedings Reliability Physics Symposium 1988","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.1988.23431","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 82
Abstract
The process compatibility and potential component reliability problems associated with surface-mount technology are investigated. Major reliability concerns observed during qualification of vendors' surface mount ICs are reported. Moisture-induced package cracking and its implication for the corrosion resistance of the package are discussed. The application of acoustic microscopy techniques such as scanning laser acoustic microscopy (SLAM) and C-mode scanning acoustic microscopy (C-SAM) for examining internal package cracking is described. The concept of threshold (safe) moisture level in a surface-mount package and the proper procedures for determining it are discussed.<>
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