Thermal/fluid performance evaluation of serrated plate fin heat sinks

I. K. Shwaish, C. Amon, J. Murthy
{"title":"Thermal/fluid performance evaluation of serrated plate fin heat sinks","authors":"I. K. Shwaish, C. Amon, J. Murthy","doi":"10.1109/ITHERM.2002.1012467","DOIUrl":null,"url":null,"abstract":"Cooling of the electronics in people movers and other rail transportation systems require the removal of high power dissipation from the electronic equipment to ensure their long term reliability and performance. In this study, the thermal performance of in-service serrated plate fin heat sink is evaluated for a range of Reynolds number by means of fully three-dimensional numerical simulations of the air flow over the heat sink. The flow is considered to be turbulent and both hydrodynamically and thermally developing. Our computations yield local and global heat transfer and flow parameters such as temperature distribution in the fin, heat transfer coefficient, Nusselt number, pressure drop, and the maximum temperature of the heat sink. The results point to the directions for optimizing the heat sink performance. Hence, variations of design parameters around the existing configurations are investigated. These parameters are fin interruption and staggering, fin height, serration spacing, fin thickness and inter-fin spacing, fin base thickness, and clearance gap between the fin tips and the upper wall of the channel that encloses the heat sink. The computations yield the optimal designs of plate fin heat sinks for transportation applications.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.2002.1012467","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7

Abstract

Cooling of the electronics in people movers and other rail transportation systems require the removal of high power dissipation from the electronic equipment to ensure their long term reliability and performance. In this study, the thermal performance of in-service serrated plate fin heat sink is evaluated for a range of Reynolds number by means of fully three-dimensional numerical simulations of the air flow over the heat sink. The flow is considered to be turbulent and both hydrodynamically and thermally developing. Our computations yield local and global heat transfer and flow parameters such as temperature distribution in the fin, heat transfer coefficient, Nusselt number, pressure drop, and the maximum temperature of the heat sink. The results point to the directions for optimizing the heat sink performance. Hence, variations of design parameters around the existing configurations are investigated. These parameters are fin interruption and staggering, fin height, serration spacing, fin thickness and inter-fin spacing, fin base thickness, and clearance gap between the fin tips and the upper wall of the channel that encloses the heat sink. The computations yield the optimal designs of plate fin heat sinks for transportation applications.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
锯齿板翅散热器的热/流体性能评价
在人员移动和其他轨道交通系统中的电子设备的冷却需要从电子设备中去除高功耗,以确保其长期可靠性和性能。在本研究中,采用全三维数值模拟的方法,对在役锯齿板翅片散热器进行了雷诺数范围内的热性能评估。这种流动被认为是湍流的,并且在流体动力学和热动力学上都在发展。我们的计算得出了局部和全局的传热和流动参数,如散热片中的温度分布、传热系数、努塞尔数、压降和散热器的最高温度。研究结果为优化散热器性能指明了方向。因此,围绕现有配置的设计参数的变化进行了研究。这些参数是翅片中断和交错,翅片高度,锯齿间距,翅片厚度和翅片间距,翅片底部厚度,以及翅片尖端与封闭散热器的通道上壁之间的间隙。计算结果为运输用板翅式散热器的优化设计提供了依据。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Application of lumped R/sub th/C/sub th/ and approximate steady-state methods for reducing transient analysis solution time Multistage thermoelectric micro coolers A new approach to the design of complex heat transfer systems: notebook-size computer design Multimedia thermal CAD system for electronics multilayer structures with compact cold plate Modeling superconformal electrodeposition in trenches
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1