Fabrication of SONOS flash memory device by using engineered tunnel barrier technique

M. Zakaria, S. R. Kasjoo, A. F. Mahyidin, A. W. Al-Mufti, R. Ayub, U. Hashim
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引用次数: 1

Abstract

Flash memory is a device that used as a tool to store data electrically without external power supply. The charge-trap such as SONOS structure is the most widely used in flash memory technology fabrication due to the advantages of this device in term of scaling and performance characteristic. Conventional Flash memory with thickness 5nm single oxide shows good performance, but suffer leakage current and data retention. To overcome this problem, a SONOS flash memory was fabricated by using techniques that known as Engineered Tunnel Barrier to replace the conventional single oxide used in conventional flash memory. In this project, the total equivalent thickness oxide for all experiments is set at the 8nm to compare the performances. Thus, it will result in a faster write and erase speed. The analysis results will determine the most preferred structure that improved the programming characteristic.
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利用工程隧道阻挡技术制备SONOS闪存器件
闪存是一种不用外部电源就能存储数据的工具。SONOS结构的电荷阱由于其在可缩放性和性能特性方面的优势,在闪存技术制造中应用最为广泛。传统的5nm厚度的单氧化物闪存性能良好,但存在漏电流和数据保留的问题。为了克服这个问题,SONOS闪存采用了工程隧道屏障技术来取代传统闪存中使用的单一氧化物。在本项目中,所有实验的总等效氧化厚度都设置在8nm,以比较性能。因此,它将导致更快的写入和擦除速度。分析结果将确定改善编程特性的最优选结构。
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