Plastic electronics based on semiconducting polymers

M. Schrodner, S. Sensfuss, H. Roth, R.-I. Stohn, W. Clemens, A. Bernds, W. Fix
{"title":"Plastic electronics based on semiconducting polymers","authors":"M. Schrodner, S. Sensfuss, H. Roth, R.-I. Stohn, W. Clemens, A. Bernds, W. Fix","doi":"10.1109/POLYTR.2001.973263","DOIUrl":null,"url":null,"abstract":"Plastic electronics are set to be one of the next applications of semiconducting polymers appearing on the market. The electronics are constructed from integrated plastic circuits (IPC) based on organic field effect transistors (OFETs). The aim of this technology is to create low cost electronics using inexpensive standard polymer technologies in combination with laser and/or printing technologies which allow mass production for low cost mass products like ident tags, electronic watermarks, smart cards, electronic labels. Although many improvements have been achieved during the last few years, numerous problems still must be solved. The authors present recent results for OFETs with conjugated polymers like polythiophenes as active semiconducting material. The performance of the OFETs strongly depends on the quality of the semiconducting layer, i.e. molecular ordering, homogeneity, purity and doping level. Several aspects of preparing OFETs with special emphasis on the effect of the properties of the semiconducting polymer on the transistor parameters are discussed.","PeriodicalId":282338,"journal":{"name":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","volume":"51 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/POLYTR.2001.973263","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5

Abstract

Plastic electronics are set to be one of the next applications of semiconducting polymers appearing on the market. The electronics are constructed from integrated plastic circuits (IPC) based on organic field effect transistors (OFETs). The aim of this technology is to create low cost electronics using inexpensive standard polymer technologies in combination with laser and/or printing technologies which allow mass production for low cost mass products like ident tags, electronic watermarks, smart cards, electronic labels. Although many improvements have been achieved during the last few years, numerous problems still must be solved. The authors present recent results for OFETs with conjugated polymers like polythiophenes as active semiconducting material. The performance of the OFETs strongly depends on the quality of the semiconducting layer, i.e. molecular ordering, homogeneity, purity and doping level. Several aspects of preparing OFETs with special emphasis on the effect of the properties of the semiconducting polymer on the transistor parameters are discussed.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
基于半导体聚合物的塑料电子产品
塑料电子产品将成为半导体聚合物出现在市场上的下一个应用领域之一。电子元件由基于有机场效应晶体管(ofet)的集成塑料电路(IPC)构成。这项技术的目的是创造低成本的电子产品,使用廉价的标准聚合物技术,结合激光和/或印刷技术,允许大规模生产低成本的大规模产品,如身份标签,电子水印,智能卡,电子标签。虽然在过去几年中取得了许多进步,但仍有许多问题有待解决。作者介绍了用共轭聚合物如聚噻吩作为活性半导体材料的ofet的最新研究结果。ofet的性能在很大程度上取决于半导体层的质量,即分子有序性、均匀性、纯度和掺杂水平。讨论了制备ofet的几个方面,重点讨论了半导体聚合物的性质对晶体管参数的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Anisotropy of the optical and electrical properties of highly-oriented polyfluorenes Interfacial fracture toughness tests suited for reliability enhancements of advanced plastic packages Calibrate piezoresistive stress sensors through the assembled structure Polymeric materials for adaptronic fibre modules Trend of solder-less joint in flip chip bonding
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1