Enabling 3D NAND Trench Cells for Scaled Flash Memories

S. Rachidi, S. Ramesh, L. Breuil, Z. Tao, D. Verreck, G. Donadio, A. Arreghini, G. V. D. Bosch, M. Rosmeulen
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Abstract

3D Trench cells with a vertical flat channel have been proposed to increase the cell density over 3D NAND gate-all-around (GAA). In this work, we investigate the device characteristics of Trench cells. In absence of curvature, Trench cells exhibit inferior program and erase in comparison to a GAA reference. However, the memory window of Trench cells is significantly improved with channel width scaling, gate stack engineering and metal gate integration. This study also provides a basis for design and fabrication of future ultradense 3D NAND memories based on the Trench architecture.
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为缩放闪存启用3D NAND沟槽单元
为了提高三维NAND栅极全能(GAA)的密度,提出了具有垂直平坦通道的三维沟槽单元。在这项工作中,我们研究了沟槽电池的器件特性。在没有曲率的情况下,沟槽细胞表现出较差的程序和擦除,与GAA参考相比。然而,沟槽单元的记忆窗口通过通道宽度缩放、栅极堆叠工程和金属栅极集成得到显著改善。该研究也为未来基于Trench架构的超密集3D NAND存储器的设计和制造提供了基础。
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