A. Tessmann, A. Leuther, V. Hurm, H. Massler, S. Wagner, M. Kuri, M. Zink, M. Riessle, H. Stulz, M. Schlechtweg, O. Ambacher
{"title":"A Broadband 220-320 GHz Medium Power Amplifier Module","authors":"A. Tessmann, A. Leuther, V. Hurm, H. Massler, S. Wagner, M. Kuri, M. Zink, M. Riessle, H. Stulz, M. Schlechtweg, O. Ambacher","doi":"10.1109/CSICS.2014.6978532","DOIUrl":null,"url":null,"abstract":"In this paper, we present the development of an ultra-broadband H-band (220 - 325 GHz) submillimeter-wave monolithic integrated circuit (S-MMIC) medium power amplifier (MPA) module for use in next generation high-resolution imaging systems and communication links operating around 300 GHz. Therefore, a variety of compact amplifier circuits has been developed by using an advanced 35 nm InAlAs/InGaAs based depletion-type metamorphic high electron mobility transistor (mHEMT) technology in combination with grounded coplanar waveguide (GCPW) circuit topology. A three-stage amplifier S-MMIC based on compact cascode devices was realized, demonstrating a maximum gain of 22.2 dB at 294 GHz and a small-signal gain of more than 16 dB over the frequency range from 184 to 312 GHz. Finally, mounting and packaging of the monolithic amplifier chip into a WR-3.4 waveguide module was accomplished with only minor reduction in circuit performance.","PeriodicalId":309722,"journal":{"name":"2014 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)","volume":"47 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-12-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"22","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSICS.2014.6978532","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 22
Abstract
In this paper, we present the development of an ultra-broadband H-band (220 - 325 GHz) submillimeter-wave monolithic integrated circuit (S-MMIC) medium power amplifier (MPA) module for use in next generation high-resolution imaging systems and communication links operating around 300 GHz. Therefore, a variety of compact amplifier circuits has been developed by using an advanced 35 nm InAlAs/InGaAs based depletion-type metamorphic high electron mobility transistor (mHEMT) technology in combination with grounded coplanar waveguide (GCPW) circuit topology. A three-stage amplifier S-MMIC based on compact cascode devices was realized, demonstrating a maximum gain of 22.2 dB at 294 GHz and a small-signal gain of more than 16 dB over the frequency range from 184 to 312 GHz. Finally, mounting and packaging of the monolithic amplifier chip into a WR-3.4 waveguide module was accomplished with only minor reduction in circuit performance.
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