A wireless front-end module for X-band applications

Abstract

This work presents a receiving module consisted of a CMOS low-noise amplifier (LNA) followed by a semi-lumped filter and a CPW-fed slot dipole antenna, both circuits are connected using low-cost bonding wires. The structure of the receiver is realized with antenna-in-package (AiP) concept, which reduces the antenna interference through the substrate to the other radio front-end (RF) circuits on the same substrate. To enlarge input impedance bandwidth of the antenna, the dipole arms are constructed with bow shape. Two-stage cascode LNA operated at 11.6 GHz is employed to provide adequate reverse isolation and power gain. For X-band applications, experimental results prove that the operation bandwidth and transmission gain of the receiving module are dominated by the input impedance bandwidth of the antenna rather than the effect of the bonding wires. Measured data of the wireless communication link shows a transmission gain of 12 dB from 10.5 to 14.5 GHz.