R. Kiumi, J. Yoshioka, F. Kuriyama, N. Saito, M. Shimoyama
{"title":"Processing, properties, and reliability of electroplated lead-free solder bumps","authors":"R. Kiumi, J. Yoshioka, F. Kuriyama, N. Saito, M. Shimoyama","doi":"10.1109/ITHERM.2002.1012552","DOIUrl":null,"url":null,"abstract":"Eutectic tin-silver (Sn-Ag), tin-copper (Sn-Cu), and tin-silver-copper (Sn-Ag-Cu) solder alloys are potential lead-free materials for low-temperature processing of solder bumps on wafers. But, before they can be adopted to replace the existing lead-free materials, processes have to be developed to provide controls over composition, height and shape uniformity, and defect formation, such as micro-voids, which are detrimental to bump reliability. Over the last six years, we have developed an electroplating technology using a dip-plating machine for processing the three types of eutectic lead-free solder bumps on silicon wafer. Our process is suitable for mass production with well-controlled bump geometry and composition, and uniformity within 10% over the entire wafer. In this paper, we will describe our process and present our results on the bump properties, such as composition, melting point, and microstructure of the bumps.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"92 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.2002.1012552","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
Eutectic tin-silver (Sn-Ag), tin-copper (Sn-Cu), and tin-silver-copper (Sn-Ag-Cu) solder alloys are potential lead-free materials for low-temperature processing of solder bumps on wafers. But, before they can be adopted to replace the existing lead-free materials, processes have to be developed to provide controls over composition, height and shape uniformity, and defect formation, such as micro-voids, which are detrimental to bump reliability. Over the last six years, we have developed an electroplating technology using a dip-plating machine for processing the three types of eutectic lead-free solder bumps on silicon wafer. Our process is suitable for mass production with well-controlled bump geometry and composition, and uniformity within 10% over the entire wafer. In this paper, we will describe our process and present our results on the bump properties, such as composition, melting point, and microstructure of the bumps.