Processing, properties, and reliability of electroplated lead-free solder bumps

R. Kiumi, J. Yoshioka, F. Kuriyama, N. Saito, M. Shimoyama
{"title":"Processing, properties, and reliability of electroplated lead-free solder bumps","authors":"R. Kiumi, J. Yoshioka, F. Kuriyama, N. Saito, M. Shimoyama","doi":"10.1109/ITHERM.2002.1012552","DOIUrl":null,"url":null,"abstract":"Eutectic tin-silver (Sn-Ag), tin-copper (Sn-Cu), and tin-silver-copper (Sn-Ag-Cu) solder alloys are potential lead-free materials for low-temperature processing of solder bumps on wafers. But, before they can be adopted to replace the existing lead-free materials, processes have to be developed to provide controls over composition, height and shape uniformity, and defect formation, such as micro-voids, which are detrimental to bump reliability. Over the last six years, we have developed an electroplating technology using a dip-plating machine for processing the three types of eutectic lead-free solder bumps on silicon wafer. Our process is suitable for mass production with well-controlled bump geometry and composition, and uniformity within 10% over the entire wafer. In this paper, we will describe our process and present our results on the bump properties, such as composition, melting point, and microstructure of the bumps.","PeriodicalId":299933,"journal":{"name":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","volume":"92 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.2002.1012552","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7

Abstract

Eutectic tin-silver (Sn-Ag), tin-copper (Sn-Cu), and tin-silver-copper (Sn-Ag-Cu) solder alloys are potential lead-free materials for low-temperature processing of solder bumps on wafers. But, before they can be adopted to replace the existing lead-free materials, processes have to be developed to provide controls over composition, height and shape uniformity, and defect formation, such as micro-voids, which are detrimental to bump reliability. Over the last six years, we have developed an electroplating technology using a dip-plating machine for processing the three types of eutectic lead-free solder bumps on silicon wafer. Our process is suitable for mass production with well-controlled bump geometry and composition, and uniformity within 10% over the entire wafer. In this paper, we will describe our process and present our results on the bump properties, such as composition, melting point, and microstructure of the bumps.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
电镀无铅焊点的工艺、性能和可靠性
共晶锡银(Sn-Ag)、锡铜(Sn-Cu)和锡银铜(Sn-Ag- cu)钎料合金是极具潜力的无铅材料,可用于硅片上的低温钎料凸起加工。但是,在它们被用来取代现有的无铅材料之前,必须开发工艺来控制成分、高度和形状均匀性,以及缺陷的形成,如微空洞,这些都不利于碰撞的可靠性。在过去的六年里,我们开发了一种电镀技术,使用浸镀机处理硅片上的三种共晶无铅焊点。我们的工艺适合大批量生产,凹凸几何形状和成分控制良好,整个晶圆均匀度在10%以内。在本文中,我们将描述我们的过程,并介绍我们的结果在凹凸的性质,如组成,熔点,和凹凸的微观结构。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Application of lumped R/sub th/C/sub th/ and approximate steady-state methods for reducing transient analysis solution time Multistage thermoelectric micro coolers A new approach to the design of complex heat transfer systems: notebook-size computer design Multimedia thermal CAD system for electronics multilayer structures with compact cold plate Modeling superconformal electrodeposition in trenches
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1