{"title":"Carrier and socket technology for high pin count QFP packages","authors":"J. Foerstel","doi":"10.1109/95.370747","DOIUrl":null,"url":null,"abstract":"The Carrier and Socket Technology for high pin count Quad Flat Pack, QFP, packages is a set of three components, that can be used in various combinations, that allow for easier manipulation of fine pitch, (fine pitch defined as packages having a lead tip to lead tip spacing of .65 millimeters or less), QFP between various shipping, test, programming, and proto- typing environments. The three components are the small outline Carrier, surface mountable Development Socket, and through hole mountable Programming Socket. The Carrier is designed to protect the leads of the QFP from deformation, while allowing the leads to make electrical connection with the contacts of the two different sockets. The Development Socket is surface mountable with a footprint that is identical to the naked QFP housed within the Carrier. The Programming Socket is a through hole mountable, clam-shell socket, which accepts the same Carrier as the Development Socket.<<ETX>>","PeriodicalId":344532,"journal":{"name":"1994 Proceedings. 44th Electronic Components and Technology Conference","volume":"38 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1994 Proceedings. 44th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/95.370747","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
The Carrier and Socket Technology for high pin count Quad Flat Pack, QFP, packages is a set of three components, that can be used in various combinations, that allow for easier manipulation of fine pitch, (fine pitch defined as packages having a lead tip to lead tip spacing of .65 millimeters or less), QFP between various shipping, test, programming, and proto- typing environments. The three components are the small outline Carrier, surface mountable Development Socket, and through hole mountable Programming Socket. The Carrier is designed to protect the leads of the QFP from deformation, while allowing the leads to make electrical connection with the contacts of the two different sockets. The Development Socket is surface mountable with a footprint that is identical to the naked QFP housed within the Carrier. The Programming Socket is a through hole mountable, clam-shell socket, which accepts the same Carrier as the Development Socket.<>
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
