Study on Solder Joint Shape Impact on Board Level Reliability for Managed NAND Mobile Package

F. Che, Yeow Chon Ong, L. Pan, Wei Yu, Hong Wan Ng
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引用次数: 1

Abstract

Board level reliability, such as solder joint reliability under temperature cycling, is essential requirement for electronic packages. At the design stage, many optimization methods are adopted like geometry, structure, and materials. Finite element analysis (FEA) is a powerful and efficient tool to assess reliability performance. However, FEA simulation is still time-consuming for numerous DOE runs. In this study, combining statistical software and FEA analyses, regression equation is generated for quick assessment on solder joint reliability (SJR) by choosing an example of effect of solder joint shape on SJR performance. Interaction of different parameters can be considered in the equation. This provides an efficient and accurate methodology for design optimization and improvement with saving cycle time for new product introduction (NPI). Such methodology can be extended to other areas to make design-for-reliability more robust and efficient.
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托管NAND移动封装中焊点形状对板级可靠性影响的研究
电路板级可靠性,如温度循环下的焊点可靠性,是电子封装的基本要求。在设计阶段,采用了几何、结构、材料等多种优化方法。有限元分析(FEA)是评估可靠性性能的一种强大而有效的工具。然而,对于大量的DOE运行,有限元模拟仍然是耗时的。本研究选取一个焊点形状对焊点可靠性影响的实例,将统计软件与有限元分析相结合,生成回归方程,用于快速评估焊点可靠性。方程中可以考虑不同参数的相互作用。这为设计优化和改进提供了一种有效和准确的方法,节省了新产品引入(NPI)的周期时间。这种方法可以扩展到其他领域,使可靠性设计更加健壮和有效。
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